PCB Libraries, Inc. | https://www.pcblibraries.com/forum/advice-for-solder-mask-paste-mask-layers_topic484_page1.html
. A real good example of this is Flexible Circuit Boards where it is best practice to solder mask define the Toe and Heel but not the side for the purpose of improving the pad adhesion to the Flex surface
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/advice-for-solder-mask-paste-mask-layers_topic484.html
. A real good example of this is Flexible Circuit Boards where it is best practice to solder mask define the Toe and Heel but not the side for the purpose of improving the pad adhesion to the Flex surface
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic484&OB=ASC.html
I’m wondering about for a long time! It is about your definite advice for the specification of solder mask and solder paste layers
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PetrolDave Report Post Thanks(0) Quote Reply Posted: 04 Apr 2016 at 3:41am Bruce P wrote: I always add additional solder mask area under Terminal Solder Mask X (+/-) and Solder Mask Y
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/saving-solder-mask-settings_topic1817.html
PetrolDave Report Post Thanks(0) Quote Reply Posted: 04 Apr 2016 at 3:41am Bruce P wrote: I always add additional solder mask area under Terminal Solder Mask X (+/-) and Solder Mask Y
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1817&OB=DESC.html
PetrolDave Report Post Thanks(0) Quote Reply Posted: 04 Apr 2016 at 3:41am Bruce P wrote: I always add additional solder mask area under Terminal Solder Mask X (+/-) and Solder Mask Y
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0.3mm and the solder mask opening is 0.2mm. These vias are under the BGA. Any idea what is the intention of previous designer of opening the solder mask under the BGA, now the board is fabricated and we are worry of short under the BGA and need to re-do the fabrication with
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/blind-via-with-smaller-solder-mask-opening_topic1110.html
. Any idea what is the intention of previous designer of opening the solder mask under the BGA, now the board is fabricated and we are worry of short under the BGA and need to re-do the fabrication
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