| https://www.eptac.com/ask/ipc-5704-vs-ipc-6012-bare-board-cleanliness-comparison/
IPC-5704 vs IPC-6012 Bare Board Cleanliness Comparison - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/soldertip/soldertip-48-the-cleanliness-of-wire-and-terminal-connections/
SolderTip #48: The Cleanliness of Wire and Terminal Connections - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/ask-helena-leo/ask/ipc-5704-vs-ipc-6012-bare-board-cleanliness-comparison
IPC-5704 vs IPC-6012 Bare Board Cleanliness Comparison - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-48-the-cleanliness-of-wire-and-terminal-connections
SolderTip #48: The Cleanliness of Wire and Terminal Connections - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/soldertips/page/2
? Read More SMT Component Shifting General Tip Question: We have a problem with chip components shifting during the reflow process, which is being detected during automatic optical inspection
| https://www.eptac.com/faqs/ask-helena-leo/ask/excess-flux-causing-intermittent-connection-issues
: We are having an issue with the cleanliness of flux. The excess no-clean flux is located in an Ethernet port connector. The units pass all tests with no issues, however
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? Read Answer Accept or Reject: Solder Contacting Component Bodies Question: We are having a discussion about whether or not solder can touch a component body
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-39-class-2-vs-class-3-assemblies
. In IPC-A-610 some of the differences are found in component placement for surface mount components, hole fill requirements for plated through holes and cleanliness requirements based upon residual
| https://www.eptac.com/soldertip/soldertip-39-class-2-vs-class-3-assemblies/
. In IPC-A-610 some of the differences are found in component placement for surface mount components, hole fill requirements for plated through holes and cleanliness requirements based upon residual
| https://productronica.com/en/trade-fair/program/live-demonstrations/cleanroom/
? Imagine you're designing and manufacturing precision mechanical watch movements - every tiny component has to fit exactly or the watch won't work properly
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