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course of its operation. Solder joint reliability has two aspects - 1) component-level solder joint reliability; and 2) board-level solder joint reliability
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. The printer prints the solder paste on the PCB, and the placement machine places the components on the printed solder paste. Setting up a reflow soldering oven furnace Setting up a reflow soldering oven requires knowledge of the solder paste used in the component
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. When the PCB enters the heating zone, the solvent and gas in the solder paste evaporate. At the same time, the flux in the solder paste wets the pad, component ends and pins, the solder paste softens, collapses, and covers the solder Plate to isolate the pad and component pins from oxygen. B
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)) component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs
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. It is a surface-mounting component (SMC/SMD, Chinese called chip component) that is packaged in a matrix of leadless or short leads or balls, mounted on the surface of a Printed Circuit Board (PCB
