| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
? More Questions Component Rework Clarification Soldering Minimum Space Requirements Gum and Hard Candy at a Workstation Soldering onto Platinum Pins Inspection Criteria for Unique Lead Geometry Question
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_aoi_mvp.html
. System can inspect SMT components pre-or post solder for presence / absence and placement verification (x,y,and theta ) polarity, solder fillet, bridging, solder opens, insufficient fillets, excess solder, and lifted leads
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/news/meet-with-the-nordson-yestech-team-smtai-for-a-demonstration-on-the-fx-940-ultra-3d-aoi
. The YESTECH team will demonstrate the FX-940 ULTRA 3D AOI with cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-brings-its-flagship-inspection-systems-to-smtai
. The Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/discover-leading-test-and-inspection-platforms-from-nordson-at-smtai
. The Nordson YESTECH FX-940 Automated Optical Inspection (AOI) offers the latest multi-dimensional technology for the inspection of solder defects, lead defects / lifted leads, component presence and position, correct part / polarity, through-hole parts, and co
ASCEN Technology | https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/936.html
Blog Solution machine News PCB conveyor system Video Channel PCB conveyor transporter PCB depaneling machine PCB loader unloader PCB conformal coating system Component lead former Component insertion
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/live-demonstrations-on-nordson-inspection-systems-at-apex
. The Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/news/nordson-yestech-wins-smt-china-magazine-awards-for-fx-940-aoi-system-with-3d-capability
& Convention Center during NEPCON China. The new Nordson YESTECH FX-940 offers the latest multi-dimensional technology for the inspection of solder defects, lead defects / lifted leads, component presence and position, correct part
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_bga-chamfer_topic727.xml
: The BGA, CGA is an exception... Author: Tom HSubject: 727Posted: 03 Dec 2012 at 3:12pmThe BGA, CGA is an exception because the plastic package is lifted off the board surface by the Balls or Columns.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-test-and-inspection-at-smt-nuremburg
. The Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs
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