| https://www.eptac.com/ask/failing-to-remove-gold-plating-in-final-assembly/
. There is no requirement to remove this gold plating prior to soldering. The only requirement for the removal of gold is for component leads and terminals which will be soldered to the printed circuit board itself
| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly
. There is no requirement to remove this gold plating prior to soldering. The only requirement for the removal of gold is for component leads and terminals which will be soldered to the printed circuit board itself
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
://www.indium.com/blog/intermetallics-in-soldering.php There are many articles and papers that have been presented on the whole gold plating issue since its introduction into the manufacturing process on printed circuit boards and in the plating on the component leads
| http://etasmt.com/cc?ID=te_news_bulletin,23576&url=_print
. Process and design-related causes: • Impurity in the component plating • Impurity in the circuit board finish • Bad or expired solder paste
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23576.chtml
. Process and design-related causes: • Impurity in the component plating • Impurity in the circuit board finish • Bad or expired solder paste
| http://etasmt.com/te_news_bulletin/2021-08-31/23576.chtml
. Process and design-related causes: • Impurity in the component plating • Impurity in the circuit board finish • Bad or expired solder paste
Heller Industries Inc. | https://hellerindustries.com/dull-solder-joints/
. Process and design-related causes of Dull Solder Joints: Impurity in the component plating Impurity in the circuit board finish Bad or expired solder paste Reflow-related causes of dull solder joints
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
: We have a situation where we have gold boards which accept gold wire bonding, but are failing a pull test. Other than making sure the boards are clean with a quick trip into the degreaser, is there any other way to refresh gold plating to help these boards pass pull testing
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
: We have a situation where we have gold boards which accept gold wire bonding, but are failing a pull test. Other than making sure the boards are clean with a quick trip into the degreaser, is there any other way to refresh gold plating to help these boards pass pull testing? Answer
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