| https://www.eptac.com/ask/gullwing-lead-deformation/
. Such damage may compromise component performance or reliability. When damage is found to this extent, the electrical parameters of the component with the lead forming irregularity should be examined to determine if the performance has been compromised
| https://www.eptac.com/faqs/ask-helena-leo/ask/gullwing-lead-deformation
. Such damage may compromise component performance or reliability. When damage is found to this extent, the electrical parameters of the component with the lead forming irregularity should be examined to determine if the performance has been compromised
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Infrared-Preheat-Module-User-Guide-22140087.pdf
. Use for any other purpose may cause damage to the equipment, injury, or death. CAUTION: Hot surface - Do NOT touch. Can cause skin burns upon contact
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/underfilling?page=2
◦ Automatic X-ray Products ◦ High-Speed Component Counting Products ◦ Detectors, Sources and Custom OEM Technologies INDUSTRIAL PRECISION SOLUTIONS
| http://etasmt.com/te_news_bulletin/2020-10-17/19961.chtml
. Infrared radiation reflow oven The infrared heat source is heated by radiation and is suitable for reflow soldering and heating of double-sided assembled substrates. 2
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/102819-truck-bed-liner-spray-guns-save-time-and-reduce-material-waste
Lubrication Systems Mixers Pest Control Systems Reservoirs and Pumps Solder Paste and Flux Syringe Barrels and Cartridges Thermal Compounds (TIM) Two-Component (2k
| http://www.szhonreal.com/productview.asp?id=60
. For internal strength generates during separation, Minimize it to value under 180uE , to avoid solder crack or component damage 2
| http://etasmt.com/cc?ID=te_news_bulletin,7161&url=_print
). The aim of the process is to form acceptable solder joints by first pre-heating the components/PCB/solder paste and then melting the solder without causing damage by overheating
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
course of its operation. Solder joint reliability has two aspects - 1) component-level solder joint reliability; and 2) board-level solder joint reliability
