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GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Die-Catalog-800-000.pdf
* = available on machines after 9/1/89 or CF8s upgraded with extended stroke capability in Stations 4&5 CF-8 Die Catalog for Component Forming Dies TABLE OF CONTENTS TYPE
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF8-Die-Catalog-800-000.pdf
* = available on machines after 9/1/89 or CF8s upgraded with extended stroke capability in Stations 4&5 CF-8 Die Catalog for Component Forming Dies TABLE OF CONTENTS TYPE
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. The key aspects that lead to an effective SMT reflow soldering process are as follows: Suitable machine Acceptable reflow profile PCB/component footprint Design Carefully printed PCB using well designed stencil Repeatable placement of surface mount components Good quality PCB
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. The key aspects that lead to an effective SMT reflow soldering process are as follows: Suitable machine Acceptable reflow profile PCB/component footprint Design Carefully printed PCB using well designed stencil Repeatable placement of surface mount components Good quality PCB
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. The key aspects that lead to an effective SMT reflow soldering process are as follows: Suitable machine Acceptable reflow profile PCB/component footprint Design Carefully printed PCB using well designed stencil Repeatable placement of surface mount components Good quality PCB
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The solder paste is added to the component pad, and after the solder paste of the bare PCB is printed, the relevant electronic components are reflow soldered and then reflow soldered
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