PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/general-discussion_forum41&SO=R&OB=desc_page2.html
> Topics / Topic Starter Rating Replies Views Last Post Forum Topics Minimum Trace Width/Spacing for BGA By SandroLanot , 11 Feb 2015 at 3
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/no-silk-on-dpak_topic1242_post4873.html
! (and yes, I knew how to change the spacing rules - but that shouldn't be necessary on something so common, pulled from your main SM library - if they can be made to work with a flea-sized resistor
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/general-discussion_forum41&SO=R_page2.html
> Topics / Topic Starter Rating Replies Views Last Post Forum Topics Spacing of Adjacent Holes By Gary K , 21 Dec 2016 at 12:08pm 1 686 By Matthew Lamkin 06 Jan 2017 at 4
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/no-silk-on-dpak_topic1242_post4880.html
! (and yes, I knew how to change the spacing rules - but that shouldn't be necessary on something so common, pulled from your main SM library - if they can be made to work with a flea-sized resistor
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1242&OB=ASC.html
. While I selected the package to start from SM.fpx, I specified the manufacturer's recommended spacing on the final pads. FPX then told me it couldn't output any Silkscreen because the geometry was too small
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/no-silk-on-dpak_topic1242_post4881.html
! (and yes, I knew how to change the spacing rules - but that shouldn't be necessary on something so common, pulled from your main SM library - if they can be made to work with a flea-sized resistor
PCB Libraries, Inc. | http://www.pcblibraries.com/LibraryExpert/POD/
(Least, Nominal, Most). See partial list to the right. Drafting Outlines Silkscreen, Assembly, Courtyard, Component Body, and Lead Terminals SMD Pad Shapes
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/overhanging-die?con=t&page=3
. Performing ball bond shear testing can be difficult due to the thin spacing between die and low profile wire bonding and the possible deflection of the surface during load tool landing and setting
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_IPCDesigner_CID-Plus.pdf
■ Component Identification ■ Electrostatic Discharge PCB Design ■ Essentials of PCB Design ■ IPC Designer Certification COUNTERFEIT COMPONENTS IDEA-STD-1010 ■ Seminars & Workshops
