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High Speed High Voltage (for Automotive Applications) Microvia Design and Testing PCB/Pad Repair RF Materials Signal Integrity Solderability Surface Finishes Via Plugging and Other Protection Technical Conference Submit Technical Paper Abstract Requirements for Submission Provide an abstract of approximately 300 words that
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(for Automotive Applications) Microvia Design and Testing PCB/Pad Repair RF Materials Signal Integrity Solderability Surface Finishes Via Plugging and Other Protection Other… Enter other
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& Wearables 2016-10-20 Learn about the benefits of using the latest innovations in fluid positioning and dispensing technology for applications specific to small, sophisticated devices
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. Moreover, the optional space electronics hardware addendum module can help you create products fit for aerospace applications. If you want to learn more about
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(electromagnetic interference) shielding and thermal interface materials. With world-class EMI and RF testing capabilities, Parker Chomerics develops and characterizes EMI coating solutions for board and component level EMI issues
Blackfox Training Institute, LLC | https://www.blackfox.com/blog/4-key-attributes-that-pcbs-need-for-aerospace-deployment/
. Moreover, the optional space electronics hardware addendum module can help you create products fit for aerospace applications. If you want to learn more about
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ProntoTEST-FIXTURE software for our Genrad ATE. Later we ordered ProntoTEST-FIXTURE for our Hewlett Packard test equipment with good results. Now we have ProntoPLACE for our two Mydata / Mycronic SMT component placement machines and use ProntoVIEW-MARKUP for
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: 4.5.1, Gold Removal Issues Question: Since we are seeing more and more components with gold finish on the solder attachment pads(specifically, leadless ICs mostly with bottom side terminations only for RF circuitry
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systems designed to provide fast temperature change and cool down, accurate positioning or parts, and elimination of a third component for cost savings
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| Rochester Institute of Technology PD02: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead
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