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ECTC 2023 - IEEE 73rd Electronic Components and Technology Conference - Heller ECTC 2023 – IEEE 73rd Electronic Components and Technology Conference The Electronic Components and Technology Conference (ECTC
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| http://etasmt.com/cc?ID=te_news_bulletin,9161&url=_print
. Common defects and treatment methods of SMT reflow soldering: bridging Bridging can be said to be one of the most common defects. If a bridge defect occurs, it may cause a short circuit between device components
| http://etasmt.com/te_news_bulletin/2019-08-05/9161.chtml
. Common defects and treatment methods of SMT reflow soldering: bridging Bridging can be said to be one of the most common defects. If a bridge defect occurs, it may cause a short circuit between device components
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. System can inspect SMT components pre-or post solder for presence / absence and placement verification (x,y,and theta ) polarity, solder fillet, bridging, solder opens, insufficient fillets, excess solder, and lifted leads
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