ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/fr-FR/divisions/adhesive-dispensing-systems/products/applicators/profile-wrapping-applicators
d'adhésifs thermofusibles, dont les adhésifs réactifs de type polyuréthane (PUR). Les matières déposées adhèrent aux profilés d'une grande variété de formes et de compositions
| https://www.eptac.com/faqs/ask-helena-leo/ask/wet-sponge-cleaning-vs-dry-brass-sponge-cleaning
. The new alloys were not drop in replacement for the existing materials and were also composed of alloy compositions which had higher melting points
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5454
. However, a common theme in most is the addition of one or more of Bi, Sb and In to existing Pb-free compositions. Often the Bi, Sb and In additions are the most concentrated addition in the alloy and lead to the formation of new phases as well as dissolving in the ß-Sn
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4722
. Thus, behaviors of Cu pillar packages during Accelerated Thermal Cycling (ATC) were examined. Correlations between the shear strength and microstructure of Cu pillars were examined for different solder compositions, and for different aging times
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
% Bi the melting temperature is about 215-220 deg C. Sn-Bi solder tends to be brittle and can also exhibit tin whiskers at compositions wherein Sn% is high
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/plasma-applications/wafer-level-packaging
. Plasma cleaning of the wafer surface improves bump adhesion and has been demonstrated to increase bump shear strength dramatically. Bump materials include solder of varying compositions and gold studs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/conformal-coating-mechanisms
. The presence of solvent in the coating prevents crosslinking and final curing of the material. Different solvent compositions in the material can change the evaporation rate
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
% Bi the melting temperature is about 215-220 deg C. Sn-Bi solder tends to be brittle and can also exhibit tin whiskers at compositions wherein Sn% is high
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
% Bi the melting temperature is about 215-220 deg C. Sn-Bi solder tends to be brittle and can also exhibit tin whiskers at compositions wherein Sn% is high
GPD Global | https://www.gpd-global.com/co_website/pdf/pump/Phosphors-LED.pdf
. With the continuing development of solid-state lighting, blended phosphor compositions will no doubt lead to speciality LEDs that have no counterpart in conventional incandescent lighting
