| https://www.eptac.com/wp-content/uploads/2021/11/eptac_08_17_16.pdf
| https://www.eptac.com/faqs/ask-helena-leo/ask/multiple-wash-steps-affecting-resistance-characteristics
the resistive element and changes the electrical functionality of the component, as some of these residues are conductive and could also impact the performance of the chip component
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
>> News Circuit Board Voids & PCB Delamination Circuit Board Voids Circuit Board Voids are cavities or air pockets inside the solder joint formed by gases that are released during reflow or by flux residues that fail to escape
| https://www.smtfactory.com/PCBA-Cleaning-Machine-PCB-Defluxing-For-Best-Coating-and-Bonding-Effect-id43566387.html
. PCB must be thoroughly cleaned of production residues as well as dirt to ensure reliable further processing and trouble-free performance
| http://etasmt.com/te_news_bulletin/2021-08-31/23574.chtml
& PCB Delamination From: Author: Publish time:2021-08-31 17:39 Clicks:16 Circuit Board Voids Circuit Board Voids are cavities or air pockets inside the solder joint formed by gases that are released during reflow or by flux residues that fail to escape from the solder before it solidifies
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
activators. RA flux has higher activity than RMA for moderately oxidized surfaces. Most RA flux residues are corrosive and should be removed. Maximum safe time before cleaning is product dependent. Residue may be removed with an appropriate solvent. Rosin
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. RA flux has higher activity than RMA for moderately oxidized surfaces. Most RA flux residues are corrosive and should be removed. Maximum safe time before cleaning is product dependent. Residue may be removed with an appropriate solvent. Rosin Mildly
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
, University of Toronto, Ontario, Canada "Evaluating the Effect of Solder Paste Residues on RF Signals between 5 and 10 GHz" 2002: C. Robert Kao, National Central University, Taiwan "Effect of Copper Concentration on the Solid-State Aging Reactions Between Tin
