| https://www.eptac.com/soldertip/acceptability-of-conformal-coating-bubbles/
: We have some PCB cards that are flooded with champagne size encapsulated bubbles. While no single bubble bridges between conductors there are numerous small bubbles similar to Figure 10-131 below, None have popped, as they are all encapsulated
| https://www.eptac.com/faqs/soldertips/soldertip/acceptability-of-conformal-coating-bubbles
: We have some PCB cards that are flooded with champagne size encapsulated bubbles. While no single bubble bridges between conductors there are numerous small bubbles similar to Figure 10-131 below, None have popped, as they are all encapsulated
| https://www.eptac.com/soldertips/acceptability-of-conformal-coating-bubbles/
: We have some PCB cards that are flooded with champagne size encapsulated bubbles. While no single bubble bridges between conductors there are numerous small bubbles similar to Figure 10-131 below, None have popped, as they are all encapsulated
| https://www.eptac.com/ask/bubbles-in-conformal-coating/
. In the process of reading your question I would consider the attached statement from the J-STD-001 document. Since the bubble is on top of the soldermask coating and if the bubble was not there would the noncommon conductors be exposed
| https://www.eptac.com/faqs/ask-helena-leo/ask/bubbles-in-conformal-coating
. In the process of reading your question I would consider the attached statement from the J-STD-001 document. Since the bubble is on top of the soldermask coating and if the bubble was not there would the noncommon conductors be exposed
| https://www.eptac.com/wp-content/uploads/2014/07/eptac_08_20_14.pdf
| https://www.eptac.com/faqs/ask-helena-leo/ask/addressing-circular-mil-area-cma-buildup
: We work in cable assemblies and had a question about Circular Mil Area (CMA) buildup. We find ourselves frequently building up our conductors when using a crimp style contact, using the Rule of 3’s
| https://www.eptac.com/what-electronics-manufacturers-need-to-know-about-stretchable-electronics/
. All circuitry is made of an active layer (the conductors that perform the electrical function of the device), and the substrate (the insulating material that the active layer is built on
| https://www.eptac.com/blog/what-electronics-manufacturers-need-to-know-about-stretchable-electronics
. All circuitry is made of an active layer (the conductors that perform the electrical function of the device), and the substrate (the insulating material that the active layer is built on
| https://www.eptac.com/ask/addressing-circular-mil-area-cma-buildup/
: We work in cable assemblies and had a question about Circular Mil Area (CMA) buildup. We find ourselves frequently building up our conductors when using a crimp style contact, using the Rule of 3’s
