| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
angle cable‐end connector. 3. flange‐mount male receptacle, either two‐ or four‐hole type. c. The use of right angle cable‐end connector shall be restricted to applications where stress‐free mounting of cables with these captive nut
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/brittle-fracture-testing?con=t&page=6
presence of micro cracks and surface defects such as scratches and chips. In these materials, the high level of stress at the tip of a crack cannot be relieved by plastic flow and so even very small defects can lead to low failure loads
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull?con=t&page=8
. The jaws grip the solder ball without damaging the bonding area and applies a load that is virtually symmetrical to the area of attach, therefore applies a more uniform stress field to the ball
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. For instance, what is the impact of reworking a SAC305/405 assembled connector using an alternate Pb-free alloy? Is changing the Pb-free alloy used within the primary attach process to match the PTH rework alloy the right solution
| https://www.eptac.com/solder-tips/
. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
J. Turbini Abstract 26-2 Solder Alloy Creep Constants for Use in Thermal Stress Analysis Robert Darveaux, Ph.D. and Corey Reichman Abstract 26-2 A Nano Silver Replacement for High Lead Solders in Semiconductor Junctions Keith Sweatman, Tetsuro
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. One school of industry thought held that a void in a solder joint would be a stress riser that initiated cracks, leading to solder joint failure