| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Hersh Kohli, Motorola, Illinois "E-Manufacturing Software for Product and Process Real-Time Monitoring" 2000: Andrew Mawer, Motorola SPS, Texas "Automotive PBGA Assembly and Board-Level Reliability with Lead-Free Versus Lead-Tin Interconnect" 1999
| https://www.eptac.com/faqs/soldertips?hsLang=en
: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/faqs/soldertips
: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. For instance, what is the impact of reworking a SAC305/405 assembled connector using an alternate Pb-free alloy? Is changing the Pb-free alloy used within the primary attach process to match the PTH rework alloy the right solution
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Abstract 32-2 The Study of Dissolution of Bi Precipitates in Sn Using a Novel In Situ Heating Technique in the SEM Peter Banh, André M. Delhaise, Doug D. Perovic Abstract 32-2 Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage, Part I
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
within the cup to dissolve gold plating; the liquid solder can then be wicked‐out with stranded wire. b. The supplier shall degold and pretin the jointing surface of the connector body by fitting the connector to a suitable sized PTFE plug held
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