PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/no-silkscreen-created-for-qfn_topic704.html
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Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Influence of Alloy Composition and Temperature Cycling Dwell Time on the Reliability of a Quad Flat No Lead (QFN) Package Richard Coyle, Peter Read, Heather McCormick, Richard Popowich, and Debra Fleming Abstract 2011 24-4 Comparison Of Several PCB Final
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
, “The Effects of Non-filled Microvia in Pad on Pbfree Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal Cycling
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
, “The Effects of Non-filled Microvia in Pad on Pbfree Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal Cycling
PCB Libraries, Inc. | https://www.pcblibraries.com/products/fpx/3D-STEP_SM-Active.asp
(LCC) Plastic Leaded Chip Carrier (PLCC) PSON D-Shape Leads PSON D-Shape Leads with Chamfer Thermal Trab PSON D-Shape Leads with Radius Thermal Tab
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/3D-STEP_SM-Active.asp
(LCC) Plastic Leaded Chip Carrier (PLCC) PSON D-Shape Leads PSON D-Shape Leads with Chamfer Thermal Trab PSON D-Shape Leads with Radius Thermal Tab
| http://etasmt.com/cc?ID=te_news_bulletin,9161&url=_print
vapor phase reflow soldering. The reason for such defects is usually caused by the fact that the thermal conductivity of the relevant component leads is too high, and the temperature rises too fast, which causes the upturn of the