Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation
Surface Mount Technology Association (SMTA) | https://www.smta.org/icehet/workshops.cfm
. Higher functionality comes with the price of high heat generation due to higher power dissipation. Design engineers must consider appropriate thermal management approach to meet today's stringent requirements for device reliability
| https://ipcapexexpo.org/education/call-for-participation
High Speed High Voltage (for Automotive Applications) Microvia Design and Testing PCB/Pad Repair RF Materials Signal Integrity Solderability Surface Finishes Via Plugging and Other Protection Technical Conference Submit Technical Paper Abstract Requirements for Submission Provide an abstract of approximately 300 words that
| https://ipcapexexpo.org/education/call-for-technical-paper-form
Extreme Requirements PCB Fabrication and Materials Quality, Reliability, Test and Inspection Other Assembly Processes Topics BTC/QFN/LGA Assembly Challenges Cleaning Coating Processes Electronics
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances
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KingFei SMT Tech | https://www.smtspare-parts.com/sale-12894127-metal-hook-spring-smt-feeder-parts-e1213706000-e1213-706-00-for-32mm-feeder.html
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