40 copper delamination results

5884 - COPPER RTV

Heller Industries Inc. | https://hellerindustries.com/parts/5884/

5884 - COPPER RTV Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New! Dual Lane, Dual Temperature Reflow Oven Pressure Curing Ovens

Heller Industries Inc.

447581 - COPPER GROUND BLOCK

Heller Industries Inc. | https://hellerindustries.com/parts/447581/

447581 - COPPER GROUND BLOCK Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.

7128 - COPPER WASHER - Box of 100

Heller Industries Inc. | https://hellerindustries.com/parts/7128/

7128 - COPPER WASHER - Box of 100 Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.

459411-02 - COPPER JOINT,HEX,FABRIC BELT - 26"

Heller Industries Inc. | https://hellerindustries.com/parts/459411-02/

459411-02 - COPPER JOINT,HEX,FABRIC BELT - 26" Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.

2996 - Tube, 1/4" O.D. Copper (sniffer tube) (INCH)

Heller Industries Inc. | https://hellerindustries.com/parts/2996/

2996 - Tube, 1/4" O.D. Copper (sniffer tube) (INCH) Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.

446994 - FABRIC MESH BELT , 10"x4.97MT, WITH GUIDE - PEEK Loop with copper, Steel String - (ROLL)

Heller Industries Inc. | https://hellerindustries.com/parts/446994/

446994 - FABRIC MESH BELT , 10"x4.97MT, WITH GUIDE - PEEK Loop with copper, Steel String - (ROLL) Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.

•  The 6012 Document also defines 3.6 Structural Integrity requirements for the boards; –  After stress testing Plated Hole Integrity after Stress –  Delamination –  Hole breakout –  Plating thickness

| https://www.eptac.com/wp-content/uploads/2016/06/eptac_07_20_16.pdf

Application Notes

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes

  1046 Multi Chip Module (MCM) Die Attach Defects 1066 Multi Chip Module (MCM) Direct Bond Copper Defects 2596 Plastic BGA2600PBGA MC to Substrate Delamination 2600 PBGA MC to Substrate Delamination 2602 PBGA Virtual Cross-Section2614Plastic BGA   Ceramic

ASYMTEK Products | Nordson Electronics Solutions

.  The time to delamination is a measure of the time it takes for the resin and copper, or resin and reinforcement, to separate or delaminate

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_11_19_08.pdf

Intermetallic Growth on PCB - Heller

Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth/

Intermetallic Growth on PCB - Heller Home » Intermetallic Growth on PCB Re-printed in partnership with  ITM Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad

Heller Industries Inc.