| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-pcb-micro-voiding
. The true root cause is still under investigation, but a Kirkendall voiding mechanism may play a part. These voids can affect solder joint reliability, particularly in instances when brittle fracture is initiated within the IMC during drop or mechanical hock to the solder joint
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/library-expert-2018-05-released_topic2343.html
: Solder Mask will be excluded in a pad stack when an area of Solder Mask is used to draw a unique overall pad shape CADSTAR: Whenever a Paste Mask or Solder Mask Pad is excluded from a pad stack, the code will now put in a 0 size reassignment pad in order to exclude it from the CPA Pad stack
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2343&OB=ASC.html
: Solder Mask will be excluded in a pad stack when an area of Solder Mask is used to draw a unique overall pad shape CADSTAR: Whenever a Paste Mask or Solder Mask Pad is excluded from a pad stack, the code will now put in a 0 size reassignment pad in order to exclude it from the CPA Pad stack
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2343&OB=ASC.html
: Solder Mask will be excluded in a pad stack when an area of Solder Mask is used to draw a unique overall pad shape CADSTAR: Whenever a Paste Mask or Solder Mask Pad is excluded from a pad stack, the code will now put in a 0 size reassignment pad in order to exclude it from the CPA Pad stack
| https://www.eptac.com/ask/problems-with-pcb-micro-voiding/
. The true root cause is still under investigation, but a Kirkendall voiding mechanism may play a part. These voids can affect solder joint reliability, particularly in instances when brittle fracture is initiated within the IMC during drop or mechanical hock to the solder joint
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
. 52In-48Sn has likewise been used as "lead-free" solder material in SMT applications. In-Sn is eutectic at 50.9In49.1Sn. In-Sn solder exhibits a substantially lower melting temperature. Tin-silver-copper
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=2
. Nordson DAGE has been at the forefront of such testing since its… Nordson DAGE UV Curing App Note Nordson DAGE Bump Shear Nordson DAGE Nordson DAGE Bondtesters provide bump shear testing for use in the production test environment to remove the solder ball from a device or substrate
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
. 52In-48Sn has likewise been used as "lead-free" solder material in SMT applications. In-Sn is eutectic at 50.9In49.1Sn. In-Sn solder exhibits a substantially lower melting temperature. Tin-silver-copper
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
. 52In-48Sn has likewise been used as "lead-free" solder material in SMT applications. In-Sn is eutectic at 50.9In49.1Sn. In-Sn solder exhibits a substantially lower melting temperature. Tin-silver-copper
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