PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_library-expert-2015-18-released_topic1784.xml
cells.Fixed an issue with TO (DPAK) when the thermal tab is recessed under the bodyComponent families with Thermal Tabs – The D2 and E2 dimensions were relocated from the Max to the Nom cellMounting Hole component family
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
. The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates ." (Co-authors: Keith Sweatman and Tetsuro Nishimura
| https://www.eptac.com/do-you-know-all-of-the-applications-for-soldering/
two metal surfaces mechanically and electrically, with the use of a metal alloy called solder. It secures the connection, so it won’t break loose from vibration or other mechanical forces and provides electrical continuity in some cases
Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-and-fabrication-in-the-aerospace-industry/
. However, pure copper is also chemically active, requiring a coating over exposed copper to prevent corrosion. These coatings typically include aerosol coatings and solder masks, although manufacturers may also use epoxy coatings as a barrier to oxidation
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t&page=6
) to apply an impact load to the solder ball so that the load is transferred down to the under bump material. High strain rate… Cold bump pull Nordson DAGE Nordson DAGE bondtesters provide cold bump pull tests to vertically remove the solder ball from a device or substrate by using patented tweezer jaws
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
. Tuttle, Cree, Inc. High Power LED Solder Joint Reliability Session 1 - Predicting Component Life + Under harsh environmental conditions like corrosion, radiation, high temperature and vibration, the aging of components is drastically accelerated. Dr
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_son-qfn-calculations_topic889.xml
; We have found that when the center pad is completely surrounded by solder mask voiding in the solder joint increases and the ability to clean flux residues out from under these parts is difficult if not impossible.
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
concentration in the solder the rate of dissolution decreases because of the concentration gradient reduction. Thus, solders with 0.7% Cu remove less copper from the plating layer than solders with 0.5% Cu. Therefore, based on this, the Cu dissolution rates of
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_IPCDesigner_CID.pdf
& IPC-7721 Instructor & Operator Certification Hand Soldering Skills ■ Soldering Basics, Wires & Terminals, Lap Solder Joints, Through-Hole and Surface Mount Training PCB Fundamentals
Surface Mount Technology Association (SMTA) | https://www.smta.org/southeast-asia/
. The conference is "claimable from HRDF under SBL scheme ." View the Technical Program Here! Keynote Speaker Recent Advances in Flip Chip, WLCSP, and FOWLP Wednesday, August 15th John H. Lau, Ph.D
