ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-assembly-and-packaging?con=t&page=4
0.1 micron feature recognition for a Diamond system), are more than capable to handle demanding applications including metal cored boards and copper backed Ball Grid Arrays (BGAs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-assembly-and-packaging?con=t&page=7
0.1 micron feature recognition for a Diamond system), are more than capable to handle demanding applications including metal cored boards and copper backed Ball Grid Arrays (BGAs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-assembly-and-packaging?con=t&page=2
0.1 micron feature recognition for a Diamond system), are more than capable to handle demanding applications including metal cored boards and copper backed Ball Grid Arrays (BGAs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-assembly-and-packaging?page=1
0.1 micron feature recognition for a Diamond system), are more than capable to handle demanding applications including metal cored boards and copper backed Ball Grid Arrays (BGAs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-assembly-and-packaging
0.1 micron feature recognition for a Diamond system), are more than capable to handle demanding applications including metal cored boards and copper backed Ball Grid Arrays (BGAs
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
. The same year, Ben co-founded a start-up company in Albuquerque, New Mexico which specialized in the production of copper nano-inks as a cheaper alternative to silver nano-inks for inkjet printed electronics
