564 copper thickness measurement results

PCB Libraries Forum : Component Leads Too Short

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_component-leads-too-short_topic1789.xml

;Whatis the application for the final assembly?  Is it Class 2? 3? Is it leador lead free?  What is the board thickness?   Whatis the component lead diameter and PCB hole diameter

PCB Libraries, Inc.

•  The 6012 Document also defines 3.6 Structural Integrity requirements for the boards; –  After stress testing Plated Hole Integrity after Stress –  Delamination –  Hole breakout –  Plating thickness

| https://www.eptac.com/wp-content/uploads/2016/06/eptac_07_20_16.pdf

Industrial Manufacturing Gauges | Nordson

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/gauges-and-instruments?con=t

. Our industrial gauges and measurement equipment are designed to provide precision readings for a number of applications, including coating thickness and temperature

ASYMTEK Products | Nordson Electronics Solutions

Shielding Laminates

ORION Industries | http://orionindustries.com/shielding-laminates.php

. Most of our materials consist of a metal foil (usually, copper or aluminum) laminated to an insulating substrate, which prevents unwanted grounding of circuits

ORION Industries

220V 50 / 60Hz Solder Paste Inspection Table Top 3D SPI-7500 Vision CE

KingFei SMT Tech | http://www.smtspare-parts.com/quality-11936650-220v-50-60hz-solder-paste-inspection-table-top-3d-spi-7500-vision-ce

. BGA.FPC.CSP Measurement items: thickness, area, volume, 3D shape, plane distance Measuring principle: laser 3 angular function method measurement Software language

KingFei SMT Tech

220V 50 / 60Hz Solder Paste Inspection Table Top 3D SPI-7500 Vision CE

KingFei SMT Tech | https://www.smtspare-parts.com/quality-11936650-220v-50-60hz-solder-paste-inspection-table-top-3d-spi-7500-vision-ce

. BGA.FPC.CSP Measurement items: thickness, area, volume, 3D shape, plane distance Measuring principle: laser 3 angular function method measurement Software language

KingFei SMT Tech

PCB Fabrication Capabilities | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/

. plated and 5 mil. laser drilled, 2/1.5 mil. line width and spacing, 16 oz. copper and a maximum PCB thickness up to .300″. Imagineering offers small volume production in 5-6 days and medium-to-large volume production in 2-3 weeks

Imagineering, Inc.

? 2 Gold Plating vs Gold Flash Question: J-STD-001 section 4.5.1 requires gold removal for through-hole component leads with gold thickness more than 2.54micrometer

| https://www.eptac.com/wp-content/uploads/2016/04/eptac_04_20_16.pdf

USA Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=3

. PCB Specifications View Matrix Part Number * Revision Quantity * Thickness 0.062" Layers * Select One 2 4 6 8 Dimensions * Materials FR4(130Tg) FR4(180Tg) from Taiwan or China Copper Weight 1 oz 4 oz Cu from Taiwan or China Finish Plating HASL

Imagineering, Inc.

First Bond Ball Pull Stud Bump Pull | Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=10

Contact Global HQ Africa Asia Central and South America Europe USA and Canada First Bond Ball/Stud Bump Pull Copper is increasingly replacing gold as the interconnect material for wire bonds, stud

ASYMTEK Products | Nordson Electronics Solutions