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件数量继续缩小 CSP/BGA 和其他电路板元件之间的禁区 (KOZ) 尺寸。 因此，点胶精度变得更加重要，以最小化 KOZ，并将底部填充流体输送到尽可能靠近封装的位置，而不会落在顶部或芯吸到邻近的元件。 毛细管底部填充和模制底部填充 毛细管底部填充与模制底部填充相比，为高性能计算设备提供了重要优势，包括数据中心的 CPU、GPU 和 AI 处理器、自动驾驶以及具有 AI 功能的移动设备。 这些设备在关键情况下运行，它们的物理尺寸很大，足以支持它们的一系列功能和高级性能。 毛细管底部填充具有以下优
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. Nordson ASYMTEK Material Dispensing Solutions High-precision, high-throughput underfill dispensing is required to meet the needs of companies who perform wafer-level packaging, especially in
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