ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2602-c-sam-and-q-bam
. The crack extends upward diagonally from the interface, but does not reach the surface. Since the crack is outside of the gated depth, it loses signal amplitude and appears dark in the c-scan image
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0309-tsop-die-cracks
. Gating was at the interface between the die and the die attach layer. Result Both examples exhibit cracks in the die. The die crack in the package at lower left above is large and complex
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/imaging-modes
. To search an internal interface for delaminations, a planar view (C-Scan or interface scan) would be recommended. If you desire to view the body of a material for voids, inclusions and other inhomogeneities that are not necessarily located at a known depth, a volumetric view (bulk scan or 3V
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/sonoscan-applications/power-and-energy
thermal interface can be the difference between exceptional performance and early failure. Sonoscan's C-SAM® acoustic microscopes can precisely measure material thickness and bonding consistency in a solar application, detecting voids, delaminations and imperfections in bond materials before problems occur
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0900-delaminations-and-cracks
Delaminations and Cracks - Application Note 900 Sample & Method In the image the echoes from the ultrasonic transducer were gated on the interface between the silicon stack and the silicone adhesive layer on a large solar panel
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
Popcorn Crack 0299 PBGA Die Face Delaminations 0309 TSOP Die Cracks 0434 PQFPs Production Scanning 0759 TSOP Cracked Die 1009 PBGA Delaminations, Through Transmission 1011 PBGA Delaminations 1012 PBGA
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
Solder crack path typically found at solder joint / BGA package interface BGAs with 50% of their solder joints containing voids in the 35-60
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
Solder crack path typically found at solder joint / BGA package interface BGAs with 50% of their solder joints containing voids in the 35-60
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