| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
| https://www.eptac.com/wp-content/uploads/2014/09/eptac_09_17_14.pdf
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
2082 Ceramic Chip Capacitor Voids and Delaminations 2083 Ceramic Chip Capacitor Acoustic Microscope Image and Cross-Section 2187 Ceramic Disc Voids2417Ceramic Chip Capacitor Large Voids 2417 Ceramic
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/sonoscan-applications/microelectronics
Optical and acoustic images showing defects. Ceramic Chip Capacitor Optical and acoustic images showing defects. Chip on Board (COB) Optical and acoustic images showing die attach defects
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2082-voids-and-delaminations
Capacitor Voids and Delaminations - Application Note 2082 Sample & Method Ceramic chip capacitors analyzed using the Bulk Scan imaging technique
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2083-voids-and-delaminations
Capacitor Acoustic Microscope Image and Cross-Section - Application Note 2083 Sample & Method A set of five multilayer ceramic chip capacitors were imaged on the C-SAM instrument using a 50 MHz
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/automotive-and-transportation?con=t&page=3
Defects - Application Note 2158 VOIDS AND DELAMINATIONS Nordson SONOSCAN Ceramic Chip Capacitor Acoustic Microscope Image and Cross-Section - Application Note 2083 DELAMINATIONS AND VOIDS Nordson SONOSCAN
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t&page=9
keeps the top surface dry. Frequency Domain Imaging (FDI)™ Nordson SONOSCAN PBGA POPCORN CRACK Nordson SONOSCAN PBGA Popcorn Crack - Application Note 245 PBGA 3D SECTIONED VOIDS Nordson SONOSCAN PBGA 3D Sectioned Voids in Molding Compound - Application Note
