Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-substrate/
Which PCB Substrate Should I Use? | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
1046 Multi Chip Module (MCM) Die Attach Defects 1066 Multi Chip Module (MCM) Direct Bond Copper Defects 2596 Plastic BGA2600PBGA MC to Substrate Delamination 2600 PBGA MC to Substrate Delamination 2602 PBGA Virtual Cross-Section2614Plastic BGA Ceramic
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1012-pbga-popcorn-cracks
About Us Sonoscan Leadership Company History Locations Patent List News Events Careers Nordson SONOSCAN Home Support Application Notes PBGA POPCORN CRACKS PBGA POPCORN CRACKS PBGA Popcorn Crack
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t&page=10
BGA - MC to Substrate Delamination - Application Note 2596 PBGA POPCORN CRACKS Nordson SONOSCAN PBGA Popcorn Crack, Through Transmission - Application Note 1012 FLEX CIRCUIT DELAMINATIONS Nordson
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/applications/test-and-inspection?con=t&page=10
: Test and Inspection DELAMINATIONS IN SUBSTRATE Nordson SONOSCAN PBGA MC to Substrate Delamination - Application Note 2600 TSOP DIE CRACKS Nordson SONOSCAN TSOP Die Cracks - Application Note 309
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