ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0245-pbga-popcorn-crack
PBGA POPCORN CRACK ACOUSTIC Products Corporate | Global Directory Division Only All of Nordson Home Products/Instruments View All Products LABORATORY ● Gen7 ● Gen6 ● D9600 ● D9600Z PRODUCTION ● FastLine P300 ● Facts2 DF2400
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0309-tsop-die-cracks
. Gating was at the interface between the die and the die attach layer. Result Both examples exhibit cracks in the die. The die crack in the package at lower left above is large and complex
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0306-smart-card-cracked-die
. Result The die in this Smart card has been cracked and the symmetry of the crack suggests that the cracking occurred as a result of improper handling during assembly
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/sonoscan-applications/microelectronics
. Smart Card Optical and acoustic images showing die crack defects. Smart Card Optical and acoustic images showing demaminations
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
Popcorn Crack 0299 PBGA Die Face Delaminations 0309 TSOP Die Cracks 0434 PQFPs Production Scanning 0759 TSOP Cracked Die 1009 PBGA Delaminations, Through Transmission 1011 PBGA Delaminations 1012 PBGA
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/products/acoustic-inspection-systems?con=t&page=8
DIE AND LEAD DELAMINATIONS Nordson SONOSCAN SOIC Die and Lead Delamination - Application Note 1086 IRREGULARITIES AND VOIDS Nordson SONOSCAN Microfluidics Channel Defects - Application Note 2158 PBGA POPCORN CRACKS Nordson SONOSCAN PBGA Popcorn Crack, Through Transmission - Application Note 1012
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2602-c-sam-and-q-bam
- Application Note 2602 Sample & Method The square feature is the critical interface, and its red color indicates that the molding compound is entirely delaminated from the die face - except for a small black-yellow questionable area
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/imaging-modes
(delamination, crack or void) in this image the delaminations at the die surface and paddle are color coded in red and yellow. Q-Bam TM The Q-BAM imaging mode provides a nondestructive cross-sectional view of a sample
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t&page=9
keeps the top surface dry. Frequency Domain Imaging (FDI)™ Nordson SONOSCAN PBGA POPCORN CRACK Nordson SONOSCAN PBGA Popcorn Crack - Application Note 245 PBGA 3D SECTIONED VOIDS Nordson SONOSCAN PBGA 3D Sectioned Voids in Molding Compound - Application Note
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/lighting-and-led?con=t&page=10
: Lighting and LED PQFP DIE CRACKS Nordson SONOSCAN PQFP Die Cracks - Application Note 147 DELAMINATIONS IN SUBSTRATE Nordson SONOSCAN Plastic BGA - MC to Substrate Delamination - Application Note 2596
