PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic12&OB=ASC.html
(possibly from vibration)? Might that cause stress on the parts and possibly crack them? I expect the leads will bend better than a component body would against the solder, but I could be wrong
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/trimming-heels-under-the-component-body_topic12_post23.html
(possibly from vibration)? Might that cause stress on the parts and possibly crack them? I expect the leads will bend better than a component body would against the solder, but I could be wrong
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-touching-glass-body-components-like-diodes
it’s just a defect if solder is only touching on top of the body as stated on other body styles. Please give clarity that solder should not touch any component body except for SOIC’s and SOT’s? Answer
| https://www.eptac.com/ask/solder-touching-glass-body-components-like-diodes/
it’s just a defect if solder is only touching on top of the body as stated on other body styles. Please give clarity that solder should not touch any component body except for SOIC’s and SOT’s
| https://www.eptac.com/faqs/ask-helena-leo/ask/type-of-water-to-use-on-soldering-sponges
wet sponge, creating a thermal shock to the plating on the tip and many times causes the plating to crack. When this happens the tip deteriorates very quickly, especially when using Lead-Free solder
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_library-expert-2017-17-released_topic2209.xml
– Add D1 dimensionChip Array component families – Add Ferrite BeadSide Concave 2/4-pin component family – Add CapacitorFixed a silkscreen Legend mapping to body issue in Chips, Molded Body, SOD &
| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor
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