Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4996
. Finally, the simulated results of crack initiation were compared with real experimental data. The comparison presented here shows good correlation between simulations and experimental tests with respect to failure modes such as the position of cracks
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. One school of industry thought held that a void in a solder joint would be a stress riser that initiated cracks, leading to solder joint failure
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. One school of industry thought held that a void in a solder joint would be a stress riser that initiated cracks, leading to solder joint failure
| https://www.eptac.com/solder-tips/
. Read Answer SolderTips: How Long Should it Take to Create a Solder Joint Question: Are you aware of any time studies or standards that have been developed to determine the amount of time it should take to create a solder joint while hand soldering, either a through-hole, or surface mount component
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
Popcorn Crack 0299 PBGA Die Face Delaminations 0309 TSOP Die Cracks 0434 PQFPs Production Scanning 0759 TSOP Cracked Die 1009 PBGA Delaminations, Through Transmission 1011 PBGA Delaminations 1012 PBGA
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/brittle-fracture-testing?con=t&page=14
presence of micro cracks and surface defects such as scratches and chips. In these materials, the high level of stress at the tip of a crack cannot be relieved by plastic flow and so even very small defects can lead to low failure loads
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/brittle-fracture-testing?con=t&page=15
presence of micro cracks and surface defects such as scratches and chips. In these materials, the high level of stress at the tip of a crack cannot be relieved by plastic flow and so even very small defects can lead to low failure loads
