| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
. High levels of gold in the solder joint will act as stress risers to initiate cracks in the solder joint, which is what we are trying to prevent
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf
| https://www.eptac.com/wp-content/uploads/2012/06/eptac_07_18_12.pdf
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/brittle-fracture-testing?con=t
presence of micro cracks and surface defects such as scratches and chips. In these materials, the high level of stress at the tip of a crack cannot be relieved by plastic flow and so even very small defects can lead to low failure loads
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/brittle-fracture-testing?con=t&page=1
presence of micro cracks and surface defects such as scratches and chips. In these materials, the high level of stress at the tip of a crack cannot be relieved by plastic flow and so even very small defects can lead to low failure loads
| https://www.eptac.com/faqs/soldertips/page/2
. Read More SolderTips: How Long Should it Take to Create a Solder Joint General Tip Question: Are you aware of any time studies or standards that have been developed to determine the amount of time it should take to create a solder joint while hand soldering, either a through-hole, or surface mount component
| http://etasmt.com/cc?ID=te_news_industry,23964&url=_print
. Poor solder joint fillet -- ramp up too slow The flux lost its activity once it stayed soaking too long. Reflow zone (above 217°C ~220°C for SAC305 solder paste
| https://www.eptac.com/soldertips/soldertips-avoiding-the-creation-of-splices-via-wire-twisting/
. The reason we do not twist wires to create splices is that it may affect the reliability of the solder joint. Over stress may crack and separate this type of splice
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/brittle-fracture-testing?con=t&page=10
presence of micro cracks and surface defects such as scratches and chips. In these materials, the high level of stress at the tip of a crack cannot be relieved by plastic flow and so even very small defects can lead to low failure loads
