| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. Once the solder has solidified, those gold dendrites can act as stress risers and can initiate cracks within the solder joint. See IPC Listserv Technet for more information on gold, the gold plating processes and the reliability issues created by gold intermetallics
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/component-placement-courtyards_topic1905.html
. Only the Toe, Heel and Side values have been updated to include 40 new incremental pin pitches. These new values are in-line with IPC-J-STD-001 for solder joint goal acceptability. i.e
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1905&OB=ASC.html
. Example is a BGA that needs lights and camera inserted somewhere on the edge of a BGA to inspect solder joints for cracks. However, it's difficult to build every little detail about PCB layout into a library part
| http://etasmt.com:9060/te_news_industry/2021-08-31/23964.chtml
. Poor solder joint fillet -- ramp up too slow The flux lost its activity once it stayed soaking too long. Reflow zone (above 217°C ~220°C for SAC305 solder paste
| http://etasmt.com/te_news_industry/2021-08-31/23964.chtml
. Poor solder joint fillet -- ramp up too slow The flux lost its activity once it stayed soaking too long. Reflow zone (above 217°C ~220°C for SAC305 solder paste
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/trimming-heels-under-the-component-body_topic12_post3020.html
"Component Leads Made of Alloy 42". So we added a new feature to the LP Calculator thinking that we were saving the world from under body solder joint short circuits, but the fact is no one ever reported an assembly
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic12&OB=ASC.html
"Component Leads Made of Alloy 42". So we added a new feature to the LP Calculator thinking that we were saving the world from under body solder joint short circuits, but the fact is no one ever reported an assembly
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/trimming-heels-under-the-component-body_topic12_post23.html
"Component Leads Made of Alloy 42". So we added a new feature to the LP Calculator thinking that we were saving the world from under body solder joint short circuits, but the fact is no one ever reported an assembly
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. Once the solder has solidified, those gold dendrites can act as stress risers and can initiate cracks within the solder joint. See IPC Listserv Technet for more information on gold, the gold plating processes and the reliability issues created by gold intermetallics
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/keynote.cfm
(Printed Circuit Board), Packaging, SJR(Solder Joint Reliability) and component quality/reliability since joined IBM/Lenovo in 1987. During his 31+ years career, he has developed various technical solutions for industry level critical problems such as industry wide BGA
