ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/publications
Passive Component January/February 2007 ACOUSTIC IMAGING OF CAPACITOR CRACKS CAUSED AT SINGULATION (KOREAN LANGUAGE) As Presented at SMT Korea November 2006
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/construction-and-architectural?page=10
3-D height, volume and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability
| https://www.smtfactory.com/strategic-collaboration-with-rmi-i-c-t-s-revolution-in-smt-solutions
. It is commonly used in the internal structure testing of electronic components, common air bubble void rate measurement, circuit short circuit open circuit, solder joint lack of soldering and missing soldering, foreign matter cracks inside, etc. Contact Us
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/divisions/test-and-inspection?con=t&page=20
Application Technologies Nordson's TEST & INSPECTION technologies are targeted for semiconductor backend, solder joint inspection, assembly and non-destructive tests
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/test-and-inspection
Application Technologies Nordson's TEST & INSPECTION technologies are targeted for semiconductor backend, solder joint inspection, assembly and non-destructive tests
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/divisions/test-and-inspection?con=t&page=22
Application Technologies Nordson's TEST & INSPECTION technologies are targeted for semiconductor backend, solder joint inspection, assembly and non-destructive tests
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/divisions/test-and-inspection?page=2
Application Technologies Nordson's TEST & INSPECTION technologies are targeted for semiconductor backend, solder joint inspection, assembly and non-destructive tests
Surface Mount Technology Association (SMTA) | https://www.smta.org/store/book_store.cfm
looking at solder joint and contamination failure, coating thickness measurement, solder joint reliability, high temperature reliability for alternative solders and substrates materials
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/zh-cn/divisions/test-and-inspection
Application Technologies Nordson's TEST & INSPECTION technologies are targeted for semiconductor backend, solder joint inspection, assembly and non-destructive tests
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