Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
mostly at the PCB side of the solder joints, with some fatigue crack initiation is found at the package side. Although package-side solder joint failures are typical in BGA thermal cycling experiments, PCB-side failures are known to occur with this
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
Heller Industries Inc. | https://hellerindustries.com/browse/page/220/
Cracking Intermetallic Growth on PCB Dull solder joints Support Manuals Request Software Downloads Document Needed Request Warranty Replacement Spare Parts Contact Contact Global Network Schedule Online
| https://www.eptac.com/wp-content/uploads/2012/06/eptac_07_18_12.pdf
| https://www.eptac.com/wp-content/uploads/2007/12/webinar_eptac_12_19_07.pdf
Heller Industries Inc. | https://hellerindustries.com/browse/page/412/
Cracking Intermetallic Growth on PCB Dull solder joints Support Manuals Request Software Downloads Document Needed Request Warranty Replacement Spare Parts Contact Contact Global Network Schedule Online
Heller Industries Inc. | https://hellerindustries.com/browse/page/441/
Cracking Intermetallic Growth on PCB Dull solder joints Support Manuals Request Software Downloads Document Needed Request Warranty Replacement Spare Parts Contact Contact Global Network Schedule Online