144 crack solder joints connector results

Lighting and LED

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/lighting-and-led?con=t&page=7

: Lighting and LED Gen7 Nordson SONOSCAN FLIP CHIP Nordson SONOSCAN Flip Chip disbonded solder bumps and halo defects - Application Note 354 Publications Nordson SONOSCAN Click on the links below to

ASYMTEK Products | Nordson Electronics Solutions

Application Notes

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes

Popcorn Crack 0299 PBGA Die Face Delaminations 0309 TSOP Die Cracks 0434 PQFPs Production Scanning 0759 TSOP Cracked Die 1009 PBGA Delaminations, Through Transmission 1011 PBGA Delaminations 1012 PBGA

ASYMTEK Products | Nordson Electronics Solutions

– February 2010 15 Gold Embrittlement •  Figure 3: [Ref. IFN 897A_1, BSE SEM image, 94X] This is a BSE SEM image of the fracture surfaces of failed connector solder joints

| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf

Full List of Heller Reflow Ovens & Equipment Spare Parts - Heller

Heller Industries Inc. | https://hellerindustries.com/browse/page/359/

Cracking Intermetallic Growth on PCB Dull solder joints Support Manuals Request Software Downloads Document Needed Request Warranty Replacement Spare Parts Contact Contact Global Network Schedule Online

Heller Industries Inc.

Full List of Heller Reflow Ovens & Equipment Spare Parts - Heller

Heller Industries Inc. | https://hellerindustries.com/browse/page/124/

Cracking Intermetallic Growth on PCB Dull solder joints Support Manuals Request Software Downloads Document Needed Request Warranty Replacement Spare Parts Contact Contact Global Network Schedule Online

Heller Industries Inc.

Full List of Heller Reflow Ovens & Equipment Spare Parts - Heller

Heller Industries Inc. | https://hellerindustries.com/browse/page/514/

Cracking Intermetallic Growth on PCB Dull solder joints Support Manuals Request Software Downloads Document Needed Request Warranty Replacement Spare Parts Contact Contact Global Network Schedule Online

Heller Industries Inc.

. Courtesy of IPC 27 Don’t Reflow Solder Paste with Solder Irons  I don’t recommend soldering irons to reflow these types of solder joints with solder paste

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_01_16_08.pdf

– February 2010 12 Gold Embrittlement •  Figure 3: [Ref. IFN 897A_1, BSE SEM image, 94X] This is a BSE SEM image of the fracture surfaces of failed connector solder joints

| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf

ECSS-Q-ST-70-18C

| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf

  solidified  and  cooled,  the  supplier  shall  clean  the  joint with one of the solvent cleaners specified in clause 5.2.3.  m. The  supplier  shall  inspect  the  solder  joints  between  the  cable  and  the  connector to ensure that the dimensions of the

•  Sections 8 discussed the application of the device and its reliability during its functional life. •  The basic thesis being the reliability of the solder joints when exposed to the operation life, thermal cycling and vibration cycling 30 Reliability and Defect Analysis Section 9, defect and failure

| https://www.eptac.com/wp-content/uploads/2013/08/eptac_08_21_13-1.pdf