ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/products/automated-optical-inspection-systems/fx-942-aoi
FX-942 AOI System | Nordson YESTECH OPTICAL Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Automated Optical Inspection Conformal Coat Inspection Solder Paste Inspection Solutions PCB Assembly Aerospace Automotive Medical
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/products/automated-optical-inspection-systems/lx-1000-aoi
LX-1000 AOI System | Nordson YESTECH OPTICAL Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Automated Optical Inspection Conformal Coat Inspection Solder Paste Inspection Solutions PCB Assembly Aerospace Automotive Medical
| http://etasmt.com:9060/te_news_industry/2021-08-31/23961.chtml
.050" SEARAY™ High Speed High Density Open Pin Field Array, has up to 500 I/O contact pins with a solder charge termination. This type of connector looks like a standard BGA type of SMT device
| http://etasmt.com/cc?ID=te_news_industry,24361&url=_print
(usually no more than 2ºC/second - check solder paste datasheet). Heating too quickly can cause defects such as components to crack and the solder paste to splatter causing solder balls during reflow. Soak
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
joint between the inner conductor of the cable and the bifurcated pin of the connector with the aid of a fine soldering iron and the solder defined in clause 5.2.1. h. After the solder has solidified and cooled, the supplier shall clean the
| http://etasmt.com/te_news_industry/2021-08-31/23961.chtml
.050" SEARAY™ High Speed High Density Open Pin Field Array, has up to 500 I/O contact pins with a solder charge termination. This type of connector looks like a standard BGA type of SMT device
| http://etasmt.com:9060/te_news_industry/2021-09-01/24361.chtml
(usually no more than 2ºC/second - check solder paste datasheet). Heating too quickly can cause defects such as components to crack and the solder paste to splatter causing solder balls during reflow. Soak
| http://etasmt.com/te_news_industry/2021-09-01/24361.chtml
(usually no more than 2ºC/second - check solder paste datasheet). Heating too quickly can cause defects such as components to crack and the solder paste to splatter causing solder balls during reflow. Soak
