PCB Libraries, Inc. | https://www.pcblibraries.com/forum/footprint-for-solderable-jumper_topic2089_post10081.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 4995 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 13 Feb 2017 at 8:51pm I'm an IPC CIT trainer for soldering and J-STD-001 solder joint acceptability and these patterns clean up really nice
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/footprint-for-solderable-jumper_topic2089.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5131 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 13 Feb 2017 at 8:51pm I'm an IPC CIT trainer for soldering and J-STD-001 solder joint acceptability and these patterns clean up really nice
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2089&OB=DESC.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5188 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 13 Feb 2017 at 8:51pm I'm an IPC CIT trainer for soldering and J-STD-001 solder joint acceptability and these patterns clean up really nice
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2089&OB=ASC.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5376 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 13 Feb 2017 at 8:51pm I'm an IPC CIT trainer for soldering and J-STD-001 solder joint acceptability and these patterns clean up really nice
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/0402-min-size-land-pattern_topic30_post6316.html
“Nominal” environment for library construction, use the “Least” environment for the 0402 (1005) land pattern. Too much solder on this micro-miniature 2-pin component causes tombstoning in the assembly reflow oven
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/0402-min-size-land-pattern_topic30_post5802.html
“Nominal” environment for library construction, use the “Least” environment for the 0402 (1005) land pattern. Too much solder on this micro-miniature 2-pin component causes tombstoning in the assembly reflow oven
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic30&OB=ASC.html
“Nominal” environment for library construction, use the “Least” environment for the 0402 (1005) land pattern. Too much solder on this micro-miniature 2-pin component causes tombstoning in the assembly reflow oven
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic30&OB=ASC.html
“Nominal” environment for library construction, use the “Least” environment for the 0402 (1005) land pattern. Too much solder on this micro-miniature 2-pin component causes tombstoning in the assembly reflow oven
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-semiconductor?con=t&page=11
… Creep test Nordson DAGE Time dependent deformation is an important failure mechanism. Our experience with solder has led us to develop methods for applying loads to small samples as the solder joint is the weakest… First
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/wafer-x-ray-metrology?con=t&page=8
… Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Nordson DAGE Ruby X-ray Inspection System Datasheet Nordson DAGE X-Plane System Option Nordson DAGE Watch the
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