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Component Cracking-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Component Cracking Component Cracking Cracking of multilayer ceramic capacitors has been attributed to excessive heating rates during reflow
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| https://www.eptac.com/wp-content/uploads/2014/09/eptac_09_17_14.pdf
| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing. Have you ever seen this and if so, what is allowed or acceptable according to IPC standards, even with the lack of verified electrical failure of these components
Heller Industries Inc. | https://hellerindustries.com/causes-defects-reflow-soldering/
Intermetallics Appearance Component Cracking Bridging Grainy Solder Laminate Discoloration Leaching Halo Effect Discolored Joint help@hellerindustries.com 1-800-394-OVEN 1-800-394-OVEN Company About News Events Careers Heller Blog Certifications Equipment Convection Reflow Ovens New
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
: Problems With Stress Cracks in Ceramic Components Question: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing
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Vacuum Applications Show Details Key Advances in Void Reduction New advances in the reflow soldering process includingvacuum technology and warpage mitigation systems Show Details Component Cracking
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