ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2515-popcorn-crack
. Popcorn cracks are the result of the explosive expansion of moisture during reflow, and often originate under the die paddle and extend upward
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0245-pbga-popcorn-crack
” originating beneath the die. Popcorn cracks result when retained moisture expands during heating such as reflow. In addition, numerous small delaminations
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t&page=10
BGA - MC to Substrate Delamination - Application Note 2596 PBGA POPCORN CRACKS Nordson SONOSCAN PBGA Popcorn Crack, Through Transmission - Application Note 1012 FLEX CIRCUIT DELAMINATIONS Nordson
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/applications/test-and-inspection?con=t&page=10
Nordson SONOSCAN PQFP Die Cracks - Application Note 147 DELAMINATIONS IN SUBSTRATE Nordson SONOSCAN Plastic BGA - MC to Substrate Delamination - Application Note 2596 PBGA POPCORN CRACKS Nordson SONOSCAN
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/lighting-and-led?con=t&page=10
PBGA POPCORN CRACKS Nordson SONOSCAN PBGA Popcorn Crack, Through Transmission - Application Note 1012 FLEX CIRCUIT DELAMINATIONS Nordson SONOSCAN Flex Circuit Delaminations - Application Note 53 PBGA
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147 DELAMINATIONS IN SUBSTRATE Nordson SONOSCAN Plastic BGA - MC to Substrate Delamination - Application Note 2596 PBGA POPCORN CRACKS Nordson SONOSCAN PBGA Popcorn Crack, Through Transmission
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/products/acoustic-inspection-systems?con=t&page=8
DIE AND LEAD DELAMINATIONS Nordson SONOSCAN SOIC Die and Lead Delamination - Application Note 1086 IRREGULARITIES AND VOIDS Nordson SONOSCAN Microfluidics Channel Defects - Application Note 2158 PBGA POPCORN CRACKS Nordson SONOSCAN PBGA Popcorn Crack, Through Transmission - Application Note 1012
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: Automotive and Transportation PBGA POPCORN CRACKS Nordson SONOSCAN PBGA Popcorn Crack, Through Transmission - Application Note 1012 FLEX CIRCUIT DELAMINATIONS Nordson SONOSCAN Flex Circuit
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. Products Content Your results for: Injection Molding Equipment PQFP DIE CRACKS Nordson SONOSCAN PQFP Die Cracks - Application Note 147 PBGA POPCORN CRACKS Nordson SONOSCAN PBGA Popcorn Crack, Through Transmission - Application Note
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Popcorn Crack 0299 PBGA Die Face Delaminations 0309 TSOP Die Cracks 0434 PQFPs Production Scanning 0759 TSOP Cracked Die 1009 PBGA Delaminations, Through Transmission 1011 PBGA Delaminations 1012 PBGA
