Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
phases in the Pb-free microstructure. RESULTS Solder Joint Void Characterization The factory x-ray inspection on the conventional or standard SMT (STD SMT) reflow assembly revealed substantial void content in the BGA solder joints of both components. The x
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
. The data finds that these test methods can be implemented at the assembly site to characterize the reliability of incoming bare boards, soldering materials, leadless and bottom terminated components
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/bonding-equipment?con=t&page=31
) manufacturers at every level of production. Select Coat, Swirl Coat, more.. Plasma Treating Nordson Corporation Nordson MARCH plasma treatment systems can perform numerous surface modification processes including surface activation, contamination removal, cross linking, etch
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/plasma-treating?con=t&page=2
. Nordson MARCH plasma treatment systems can perform numerous surface modification processes including surface activation, contamination removal, cross linking, etch by chemical reaction, and physical bombardment
| https://www.eptac.com/wp-content/uploads/2013/09/eptac_09_18_13.pdf
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/plasma-treating?con=t&page=34
. Nordson MARCH plasma treatment systems can perform numerous surface modification processes including surface activation, contamination removal, cross linking, etch by chemical reaction, and physical bombardment
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/plasma-treating?con=t&page=33
. Nordson MARCH plasma treatment systems can perform numerous surface modification processes including surface activation, contamination removal, cross linking, etch by chemical reaction, and physical bombardment
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/custom-interconnect-limited-installs-latest-nordson-select-novo-460pd-selective-soldering-system
460PD by filling one pot with SAC305 alloy and the other with tin-lead alloy. As each board type is programmed into the machine, we can configure it to use the relevant solder pot with zero chance of cross contamination
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
phases in the Pb-free microstructure. RESULTS Solder Joint Void Characterization The factory x-ray inspection on the conventional or standard SMT (STD SMT) reflow assembly revealed substantial void content in the BGA solder joints of both components. The x
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
phases in the Pb-free microstructure. RESULTS Solder Joint Void Characterization The factory x-ray inspection on the conventional or standard SMT (STD SMT) reflow assembly revealed substantial void content in the BGA solder joints of both components. The x
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
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Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea
Phone: +82-1029254936
