| https://www.eptac.com/faqs/ask-helena-leo/ask/air-bubbles-or-voids-in-solder-joints
: We did some cross sectioning of solder joints on a PCB assembly and found some air bubbles trapped in the solder joints. Do you know if there is an IPC standard to specify the maximum allowable air bubbles or voids in a solder joint? Question
| https://www.eptac.com/ask/air-bubbles-or-voids-in-solder-joints/
: We did some cross sectioning of solder joints on a PCB assembly and found some air bubbles trapped in the solder joints. Do you know if there is an IPC standard to specify the maximum allowable air bubbles or voids in a solder joint
| https://www.eptac.com/faqs/ask-helena-leo/page/4
. Could you elaborate on... Read More Air Bubbles or Voids in Solder Joints QUESTION Question: We did some cross sectioning of solder joints on a PCB assembly and found some air bubbles trapped in the solder joints
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
) metallographic cross-sectioning thru package/solder joint interface showed a high incidence of voiding not observed in orthogonal cross-section
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
) metallographic cross-sectioning thru package/solder joint interface showed a high incidence of voiding not observed in orthogonal cross-section
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
Techniques for Identifying Defects in BGA Joints: TDR, 2DX and Cross Section / SEM Comparison - Comparing X-ray inspection with time domain reflectometry and cross sectioning for finding BGA joint defects. Literature Test & Inspection Solutions for SMT
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
earlier failure in thermal cycling. For failure analysis, cross sectional images can be used compliment the x-ray images, but destructive cross sectioning obviously cannot be used to characterize samples before they are placed into thermal cycling. To be
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
earlier failure in thermal cycling. For failure analysis, cross sectional images can be used compliment the x-ray images, but destructive cross sectioning obviously cannot be used to characterize samples before they are placed into thermal cycling. To be
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
earlier failure in thermal cycling. For failure analysis, cross sectional images can be used compliment the x-ray images, but destructive cross sectioning obviously cannot be used to characterize samples before they are placed into thermal cycling. To be
supposed to be online for the IPC-A-600H CIS Training Program. Do you know the direct link or where I can find it? Read Answer Air Bubbles or Voids in Solder Joints Question: We did some cross sectioning of solder joints on a PCB assembly and found some air
