| https://www.eptac.com/faqs/soldertips/soldertip/accept-or-reject-solder-contacting-component-bodies
. In reflow, excessive solder paste may be applied during the stenciling process. Regardless, these process indicators should be reviewed and addressed
| https://www.eptac.com/soldertips/accept-or-reject-solder-contacting-component-bodies/
. In reflow, excessive solder paste may be applied during the stenciling process. Regardless, these process indicators should be reviewed and addressed
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/workshops.cfm
Plan view Through-scan Thermography Decapsulation Micro-probing Liquid crystal Emission microscopy Front side Back side Micro-sections SEM imaging Plan view Cross-sections EDX analysis Less common but useful
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
(thermal fatigue reliability) by 23%. The photomicrographs taken from orthogonal cross sections of failed thermal cycling samples show that microvoiding and its effects on crack propagation are not always evident or easy to detect using
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
(thermal fatigue reliability) by 23%. The photomicrographs taken from orthogonal cross sections of failed thermal cycling samples show that microvoiding and its effects on crack propagation are not always evident or easy to detect using
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
(thermal fatigue reliability) by 23%. The photomicrographs taken from orthogonal cross sections of failed thermal cycling samples show that microvoiding and its effects on crack propagation are not always evident or easy to detect using
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
view through a volume. The same technique can be applied to the inspection of electronics. For electronic applications, it provides the ability to make continuous cross-sections through any plane within an object – all with the added advantage of not
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
view through a volume. The same technique can be applied to the inspection of electronics. For electronic applications, it provides the ability to make continuous cross-sections through any plane within an object – all with the added advantage of not
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-board-design/
. But when it comes to creating a PCB, the process isn’t as simple as you might think. There are many intricacies to PCB board design that need to be considered if
| https://www.eptac.com/ipcwhma-a-620-revision-b-just-released/
. “Depending on their customers’ needs, users can look at different sections and know they’re meeting industry or regional requirements,” said T. John Laser, a manufacturing engineer at L-3 Communications and chair of the IPC task group that developed the standard
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