Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
experiments in this study were performed on an OSP finished board. Finishes such as OSP which do not have a nickel later represent the worst case scenario with respect to Cu dissolution. An OEM server product was used as the test vehicle throughout this study
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
. Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=5
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| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
. Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
. Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305
| https://pcbasupplies.com/alloy-solder-paste-enig/
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
• Profile shape is similar with slightly higher peak temperatures. • Both Nitrogen and Air atmospheres can be used with equal success. (Depends on paste formulation and manufacturer’s recommendation
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