Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
experiments in this study were performed on an OSP finished board. Finishes such as OSP which do not have a nickel later represent the worst case scenario with respect to Cu dissolution. An OEM server product was used as the test vehicle throughout this study
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
. Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/
* Materials FR4(130Tg) FR4(170Tg) FR4(180Tg) from Taiwan or China Copper Weight 1 oz 2 oz 3 oz 4 oz Cu from Taiwan or China Finish Plating ENIG1U" (Immersion Gold) HASL (Leaded
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
. Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
. Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=2
* Select One 1 2 3 4 5 6 8 Dimensions * Materials FR4(130Tg) FR4(170Tg) FR4(180Tg) from Taiwan or China Copper Weight 1 oz 2 oz 3 oz 4 oz Cu from Taiwan or China Finish Plating ENIG1U" (Immersion Gold) HASL (Leaded
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=5
* Materials FR4(130Tg) FR4(170Tg) FR4(180Tg) from Taiwan or China Copper Weight 1 oz 2 oz 3 oz 4 oz Cu from Taiwan or China Finish Plating ENIG1U" (Immersion Gold) HASL (Leaded
| https://pcbasupplies.com/alloy-solder-paste-enig/
. Recommended for ENIG finish In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
% Sn finish OSP over Cu pad Sn63Pb37, Type 3 powder, No-clean flux 1206, 0805, 0603, 0402 all 100% Sn finish HASL SnPb over Cu pad The test vehicle designed is shown in Figure 1
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
% Sn finish OSP over Cu pad Sn63Pb37, Type 3 powder, No-clean flux 1206, 0805, 0603, 0402 all 100% Sn finish HASL SnPb over Cu pad The test vehicle designed is shown in Figure 1
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