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. The solder joint quality of PCBA soldering depends entirely on the performance of the reflow soldering oven equipment and the setting of the temperature curve
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. Temperature control accuracy of reflow soldering heater; ⅡKey process parameters of reflow soldering oven process 1. Soldering temperature curve
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. 2. Process automation: Lead-free reflow soldering realizes full-automatic precision lead-free soldering, and the entire process curve is automatically controlled. 3
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The reflow soldering oven equipment is the key equipment in the SMT assembly process. The solder joint quality of PCBA soldering depends entirely on the performance of the reflow soldering oven equipment and the setting of the temperature curve
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The reflow soldering oven equipment is the key equipment in the SMT assembly process. The solder joint quality of PCBA soldering depends entirely on the performance of the reflow soldering oven equipment and the setting of the temperature curve
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. Soldering temperature curve: According to factors such as the number and thickness of the multilayer board of the PCB, the volume and density of the soldered components, the area and thickness of the copper layer on the PCB, etc
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. Soldering temperature curve: According to factors such as the number and thickness of the multilayer board of the PCB, the volume and density of the soldered components, the area and thickness of the copper layer on the PCB, etc
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solder on both sides of the component melts and bonds to the main board. 1. Set a reasonable reflow soldering oven temperature curve and perform real-time testing of the temperature curve on a regular basis. 2
