| http://etasmt.com:9060/te_news_industry/2013-04-28/4161.chtml
improve the quality of solder joints, sometimes we need to use the nitrogen reflow. Nitrogen is an inert protective gas, it can protect circuit board pad from oxidizing in the welding, It plays a significant improving effect to improve the weldability of
| http://etasmt.com/te_news_industry/2013-04-28/4161.chtml
improve the quality of solder joints, sometimes we need to use the nitrogen reflow. Nitrogen is an inert protective gas, it can protect circuit board pad from oxidizing in the welding, It plays a significant improving effect to improve the weldability of
| http://etasmt.com/cc?ID=te_news_industry,4361&url=_print
), the pad is easily oxidized, often caused problems that solder wetting angle is too largely exposed and copper pad phenomenon. Although a number of electronics manufacturers for operating costs consideration is not temporarily using nitrogen, but with
| http://etasmt.com/cc?ID=te_news_industry,24165&url=_print
. • The use of nitrogen reflow In order to improve the quality of solder joints, sometimes we need to use the nitrogen reflow. Nitrogen is an inert protective gas, it can protect circuit board pad from oxidizing in the welding, It plays a significant improving effect to improve the weldability of lead-free solder
| http://etasmt.com:9060/te_news_industry/2021-09-01/24165.chtml
. • The use of nitrogen reflow In order to improve the quality of solder joints, sometimes we need to use the nitrogen reflow. Nitrogen is an inert protective gas, it can protect circuit board pad from oxidizing in the welding, It plays a significant improving effect to improve the weldability of lead-free solder
| http://etasmt.com/te_news_industry/2021-09-01/24165.chtml
. • The use of nitrogen reflow In order to improve the quality of solder joints, sometimes we need to use the nitrogen reflow. Nitrogen is an inert protective gas, it can protect circuit board pad from oxidizing in the welding, It plays a significant improving effect to improve the weldability of lead-free solder
| http://etasmt.com:9060/te_news_industry/2013-05-06/4361.chtml
oxidized, often caused problems that solder wetting angle is too largely exposed and copper pad phenomenon. Although a number of electronics manufacturers for operating costs consideration is not temporarily using nitrogen, but with the continuous
| http://etasmt.com/te_news_industry/2013-05-06/4361.chtml
oxidized, often caused problems that solder wetting angle is too largely exposed and copper pad phenomenon. Although a number of electronics manufacturers for operating costs consideration is not temporarily using nitrogen, but with the continuous
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints
