Heller Industries Inc. | https://hellerindustries.com/opensor-insufficient-solder/
: Non-coplanar leads on the component Excessive warpage of the PCB or substrate Poor wetting Insufficient amount of solder due to improper printing parameters Skips in the printed solder due to blocked
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/controlflow-solder-nozzles
4.0 Software Infrared Preheating Board Warp Compensation Auto Solder Nozzle Tinning Bullet and Mini-Wave Solder Nozzle Dual Solder Nozzles 75 mm Wave Nozzle Solder Pot Service Cart De-bridging Knife
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5476
Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability 中文 MEMBERS LOGIN Membership Become a Member
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
Solder Selection Guide Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. De-soldering The removal of solder and components from a circuit, usually for purposes of repair. De-wetting A condition where molten solder has coated a surface and then receded, leaving irregularly shaped mounds of solder separated by areas covered with a thin solder film
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. De-soldering The removal of solder and components from a circuit, usually for purposes of repair. De-wetting A condition where molten solder has coated a surface and then receded, leaving irregularly shaped mounds of solder separated by areas covered with a thin solder film
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
Assembly Process Implementation for BGAs. The inspection criteria for Ball Grid Array (BGA) and MicroBGA often call for voiding under 20%. A low-void solder paste is required to meet the very low-voiding limits for Class 3 assemblies. UV-traceable flux
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/es-es/divisions/efd/resources/solder-selection-guide
para BGA. Los criterios de inspección para Ball Grid Array (BGA) y MicroBGA a menudo exigen un vacío inferior al 20 %. Se requiere una soldadura en pasta de bajo vacío para cumplir con los límites de muy bajo vacío para ensambles Clase 3. Flujo
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
) European Union Directive has significantly reduced the use of tin/lead surface finishes for component terminations. A reexamination of solder joint wetting of lead-free solders with the new component terminations is key to establishing thermal process profiles that ensure acceptable solder joint integrity
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/fr-fr/divisions/efd/resources/solder-selection-guide
critères d'inspection pour les Ball Grid Array (BGA) et MicroBGA exigent un taux de porosité inférieur à 20 %. Une pâte à souder à faible porosité est nécessaire pour respecter les limites de très faible taux de porosité pour les assemblages de classe 3
