66 defect, gold on connector pins results

Gold Removal Issues with Hollow Cup Connectors - EPTAC - Train. Work Smarter. Succeed

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: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector

Failing to Remove Gold Plating in Final Assembly - EPTAC - Train. Work Smarter. Succeed

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: If the gold plating on the surface of via holes is not removed from the printed circuit boards, does this constitute a defect or failure of the

J-STD-001F 4.5.1 Gold Removal Class 2 Requirement Changed - EPTAC - Train. Work Smarter. Succeed

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J-STD-001F 4.5.1 Gold Removal Class 2 Requirement Changed - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

) larger than the lead in the hole for solder to flow into plated through hole. 8 Example of Lead Protrusion 9 Lead Clinching 10 Minimum Electrical Spacing Damaged Pins and Connectors 12 Damaged Pins in Connector Can they be repaired or replaced

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Soldertips

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. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector

Soldertips

| https://www.eptac.com/faqs/soldertips

. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector

– Special ASIC component – Connector Pins – Terminals • Cups – Board Contact – Board conductor traces 18 Class 3 requirement • Double tinning of the gold plated item to remove all the gold

| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf

. •  On the data sheet of the connector, it indicates Gold Flash Overall for contact plating. –  Nowhere does the data sheet document the gold thickness

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Soldering Minimum Space Requirements - EPTAC - Train. Work Smarter. Succeed

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. Regardless of the wire size, when soldering a wire into a connector, the acceptable conditions are the same. Check IPC-A-610E, on page 6-51, where it states that the wire will be inserted to the full depth of the cup and in contact with the back wall of the cup

The Need For Gold Removal On Solderable Surfaces 2 The Criteria J-STD-001 – 4.5.1 Gold Removal •  Gold Shall Be Removed: N1P2D3 –  From at least 95% of the surfaces to be soldered of the through-hole component leads with

| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf