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. Exiting signals are detected by a sensor located below the sample. Result The advantage of THRU-Scan is that it can quickly determine whether a defect exists at any depth within the sample
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Note 309 Optical image of a TSOP, diagram showing defect, Acoustic image of large crack, Acoustic image showing a smaller crack. Sample & Method Two TSOPs were imaged on C-SAM from the top side
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. In three of the packages, there are small areas within the large defect region that are not delaminated. The solder bumps are visible in these and other areas exhibiting good transmission
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(a defect one might expect from higher temperatures), but the die has been completely disbonded (red) from the molding compound
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2566-die-surface-delaminations
. Exiting signals are detected by a sensor located below the sample. Result The advantage of THRU-Scan is that it can quickly determine whether a defect exists at any depth within the sample
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/test-and-inspection?page=4
the most experienced source in Acoustic Microscopy for non-destructive internal inspection and analysis. Products Content Heated Stage The DAGE Heated Workholder System extends the capability of the 4000Plus bondtester, allowing you to assess the characteristics of bonds and materials when subjected to
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) technology for nondestructive internal inspection and analysis. Nordson's Sonoscan C-SAM acoustic microscopes are recognized as the benchmark for accuracy, and through our SonoLab® division
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/products/acoustic-inspection-systems/j610
Related Information J610 Spec Sheet J610™ A large-area scan bed, semiautomated acoustic microscope used for component screening applications and analysis
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. Result This Acoustic Solid shows only the external features of the PBGA. No defects are visible acoustically in this image because no internal defect reaches the surface of the Acoustic Solid, which can be fully rotated in 3 dimensions. Sectioning
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0299-pbga-die-face-delaminations
. The smaller red areas just outside the periphery of the die show delamination between the interconnect wires and mold compound. Delamination in this region can allow for moisture to collect leading to corrosion of the wires. In the non-defect (gray
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