Surface Mount Technology Association (SMTA) | https://www.smta.org/icehet/workshops.cfm
examine how AI is forever changing the way we manufacture and inspect things. Topics Included: Electronic component inspection and failure analysis Component counting and material management Reverse engineering Counterfeit detection Real-time defect
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis
Surface Mount Technology Association (SMTA) | https://www.smta.org/europe/
Board Selective Soldering a Big HIT at Henkel Lead-Free & Tin/lead Selective Soldering, Design, Quality Control & Practical Defect Solutions Tuesday 15 th October, Henkel, Hemel Hempstead
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t&page=21
. Comparing Digital and Analogue X-ray Inspection for BGA, Flip Chip and CSP Nordson DAGE Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Nordson DAGE Nordson DAGE
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/applications/test-and-inspection?con=t&page=8
DAGE’s new micro materials tester – Prospector™. Designed for the most advanced failure analysis investigations, Prospector brings 5 new perspectives into the one instrument to… Asia
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-to-exhibit-full-range-of-market-leading-test-and-inspection-systems
. The state of the art 3D software uses a dedicated number of angle projections for 3D reconstruction and delivers slice images needed for high quality 3D solder joint analysis
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/technical-papers-x-ray-inspection
Real Time X-ray Analysis of Void Formation and Dynamics in QFN Devices During Reflow High powered devices require electrical circuits with good thermal conductance and minimal voiding, to maintain long
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-assembly-and-packaging?con=t&page=11
) provide the best in the industry X-ray inspection solutions for production, engineering, R&D, and failure analysis. Easy to use, providing highest quality images with sub-micron resolution (market leading
