Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
| http://etasmt.com/cc?ID=te_news_bulletin,23569&url=_print
. It robs solder from the interconnection, and is usually caused by uneven heating between the materials being joined. This is seldom observed in convection dominant reflow and was more a trait in older IR dominant reflow and vapor-phase technologies
| http://etasmt.com/cc?ID=te_news_bulletin,9161&url=_print
component leads to exacerbate the core wash phenomenon. For the treatment of reflow soldering defects: in the vapor phase reflow soldering, the SMA can be preheated enough before being placed in the vapor phase furnace in the equipment
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23569.chtml
. It robs solder from the interconnection, and is usually caused by uneven heating between the materials being joined. This is seldom observed in convection dominant reflow and was more a trait in older IR dominant reflow and vapor-phase technologies
| http://etasmt.com/te_news_bulletin/2021-08-31/23569.chtml
. It robs solder from the interconnection, and is usually caused by uneven heating between the materials being joined. This is seldom observed in convection dominant reflow and was more a trait in older IR dominant reflow and vapor-phase technologies
| http://www.szhonreal.com/productview.asp?id=39
& open circuit in BGA package,bubble area in BGA inspection and auto-judgment 4.Aerospace and military,aerofoil,bullet etc. 5.Troche in medicine,FRP in chemical products,resin,ceramics 6
Heller Industries Inc. | https://hellerindustries.com/wicking-defetcs/
. It robs solder from the interconnection, and is usually caused by uneven heating between the materials being joined. This is seldom observed in convection dominant reflow and was more a trait in older IR dominant reflow and vapor-phase technologies
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
. Formic acid reflow has been developed in industry as a fluxless reflow technology. During the process, formic acid vapor in a nitrogen atmosphere is introduced into the oven as an oxide removal agent
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
/ Corner Glue/ Other Polymeric Reinforcements Vapor Phase Reflow Yield Improvement Business/Supply Chain: Capacity Modeling Conict Minerals Contract Manufacturing Counterfeit Parts Doing Business in Overseas Environmental Issues Lean Manufacturing Onshoring Operations Management Part Obsolescence RoHS
| http://etasmt.com/te_news_bulletin/2019-08-05/9161.chtml
component leads to exacerbate the core wash phenomenon. For the treatment of reflow soldering defects: in the vapor phase reflow soldering, the SMA can be preheated enough before being placed in the vapor phase furnace in the equipment
